SKU: 58437705837
Ships within 48 hours · Estimated delivery Nov 3 - Nov 8
Open the package to ensure that both groups can be normally extruded: Install the mising mouth
upgraded screw
and 1 group of DC DC-regulated power ports
ZTE (Qualcomm)
thickened base
XZZ AR SAM Middle Layer Reballing Platform for S21/S22/S23/S24/S25 Ultra Option:S20+ mold+stencil Open the package to ensureXZZ AR Series SAM Motherboard Middle Layer Planting Tin Platform for Samsung S20 S26 Ultra. XINZHIZAO XZZ Samsung motherboard reballing platform with C6 magnetic base, S20 S25, S20 Plus S25+, S20 Ultra S26U positioning platform and mid layer stencil for Samsung motherboard soldering repair. Models: S20 Ultra, S21 Ultra, S22 Ultra, S23 Ultra, S24 Ultra, S25 Ultra, S26 Ultra positioning platform with mid layer stencil. S20, S21, S22, S23, S24, S25
US$ 9150.00
US$ 484.50
US$ 8850.00
US$ 264.50
US$ 384.50
US$ 184.50
US$ 34.00
