SKU: 88904639901
Ships within 48 hours · Estimated delivery Nov 6 - Nov 11
Option 3: for iPhone X Board Disassembly
bga hot air rework station+soldering iron
Equipment size: 298*198*157mm
cleaning and storage for BGA PCB chip soldering desoldering
Support handles: T115
RELIFE RL-601Q PRO Rotating Glass Fixture Phone PCB IC Welding Clamp Option:RL-601Q Pro glass fixture Option 3: for iPhone XRELIFE RL 601Q RL 601Q PRO Rotating Tempered Glass Fixture for Mobile Phone iPhone Motherboard CPU BGA Chips Soldering Repair. 360 damped rotation, high temperature resistant tempered glass, easy to clean, metal anti slip base. Suitable for mobile phone motherboard repair, chip degumming, CPU, Nand flash and ICs welding, etc. Option: 1. RELIFE RL 601Q Rotating Circular Glass Clamp. 2. RELIFE RL 601Q Pro Rotating Damping Tempered Glass Fixture. Relife
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